Industrial PCIe Gen3x4, NVMe

Apro

Model HERMES-L
Flash Type 3D-NAND
Capacity 2242: 64GB~512GB 2280: 64GB~1TB
Compatibility NVM ExpressTM 1.3 Standard & PCI Express® Base Specification Rev 3.0
Data transfer rate PCI Gen3 x 4 NVMe interface(2242/2280)
Sequential read (Max.) 2242: 2,000 MB/sec 2280: 2,000 MB/sec
Sequential write (Max.) 2242: 1,200 MB/sec 2280: 1,850 MB/sec
Operating temp. (STD/IND or WIDE) S : 0˚C~+70˚C/ W : -40˚C~+85˚C
Power requirement +3.3 V ± 5%
Wear-leveling Static and Dynamic
TBW Up to 1,193 TBW at 1TB
Erase counts 3,000
Dimension (WxLxH,mm) 2242: 22.00 x 42.00 2280: 22.00 x 80.00

Silicon Power

  • Compliant with NVMe Express 1.3
  • Supports Data Security AES Encryption (optional)
  • Supports SP Toolbox Smart Health Monitoring System software
Model MEC350S MEC350E MEC3KOE MEA3K0E
Flash Technologie 3D TLC 3D TLC 3D TLC 3D TLC
Interface PCIe Gen3x4, NVMe PCIe Gen3x4, NVMe PCIe Gen3x4, NVMe PCIe Gen3x4, NVMe
Capacity 128GB ~ 2TB 128GB ~ 1TB 64GB ~ 2TB 64GB ~ 512GB
Seq. Performance Read (max.) 3,400 MB/s 1,600 MB/s 2,600 MB/s (estimated) 2,000 MB/s (estimated)
Seq. Performance Write (max.) 2,900 MB/s 1,400 MB/s 1,700 MB/s (estimated) 1,500 MB/s (estimated)
Random 4K Read (IOPS max.) 345.000 230.000 295.000 (estimated) 220.000 (estimated)
Random 4K Write (IOPS max.) 350.000 225.000 210.000 (estimated) 200.000 (estimated)
Power Requirement DC 3.3V DC 3.3V DC 3.3V DC 3.3V
Power Consumption (max.) 2450 mA 2050 mA 1500 mA -
Power Consumption (idle) 230 mA 150 mA 280 mA -
Dimension (mm) 80.0 x 22.0 x 3.6 80.0 x 22.0 x 3.6 80.0 x 22.0 x 3.6 42.0 x 22.0 x 3.6
MTBF ≒2,000,000 hrs ≒2,000,000 hrs ≒2,000,000 hrs ≒2,000,000 hr
Temperature
Operating 0°C - 70°C: Standard SP***GIMEC35*SV0 SP***GIMEC35*EV0 SP***GIMEC3F*SV0 SP***GIMEA3F*SV0
Operating -15°C ~85°C: Extended SP***GIMEC35*SE0 - - -
Operating -40°C ~ 85°C: Wide SP***GIMEC35*SW0 - - -
Key Features
Power Shield
Power Fail Protection
End-to-End Data Protection
TRIM
S.M.A.R.T
DEVSLP
Advanced Encryption Standard 256
SP SMART Utility