Eigenschaften
Beschreibung
APROs High-Speed Industrial M.2 PCIe SSDs stellen einen embedded Speicher für den direkten Anschluss an die M.2 PCIeSchnittstelle des Mainboards dar. Die Industrial M.2 PCIe SSDs sind in Kapazitäten von 64GB bis zu 2TB verfügbar.
Der integrierte Controller stellt die Zuverlässigkeit und Datensicherheit auf Basis von S.M.A.R.T., Fehlerkorrekturverfahren, Bad-Sector-Management, statischem-, dynamischem und globalem Wear-Leveling sicher. Der verwendete3D NAND Flash garantiert hierbei die gewünschte Performance und Langlebigkeit der Speichermodule.
Weitere Eigenschaften der Industrial M.2 PCIe Gen3x4 SSD
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Model | HERMES-L | |||
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Flash Type | 3D-NAND | |||
Capacity | 2242: 64GB~512GB 2280: 64GB~1TB | |||
Compatibility | NVM ExpressTM 1.3 Standard & PCI Express® Base Specification Rev 3.0 | |||
Data transfer rate | PCI Gen3 x 4 NVMe interface(2242/2280) | |||
Sequential read (Max.) | 2242: 2,000 MB/sec 2280: 2,000 MB/sec | |||
Sequential write (Max.) | 2242: 1,200 MB/sec 2280: 1,850 MB/sec | |||
Operating temp. (STD/IND or WIDE) | S : 0˚C~+70˚C/ W : -40˚C~+85˚C | |||
Power requirement | +3.3 V ± 5% | |||
Wear-leveling | Static and Dynamic | |||
TBW | Up to 1,193 TBW at 1TB | |||
Erase counts | 3,000 | |||
Dimension (WxLxH,mm) | 2242: 22.00 x 42.00 2280: 22.00 x 80.00 |
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Model | MEC350S | MEC350E | MEC3K0E | MEC3F0S |
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Flash Technologie | 3D TLC | 3D TLC | 3D TLC | 3D TLC |
Interface | PCIe Gen3x4, NVMe | PCIe Gen3x4, NVMe | PCIe Gen3x4, NVMe | PCIe Gen3x4, NVMe |
Capacity | 128GB ~ 2TB | 128GB ~ 1TB | 64GB ~ 2TB | 1TB~4TB |
Seq. Performance Read (max.) | 3,400 MB/s | 1,600 MB/s | 2,600 MB/s (estimated) | 3,400 MB/s |
Seq. Performance Write (max.) | 2,900 MB/s | 1,400 MB/s | 1,700 MB/s (estimated) | 3,000 MB/s |
Random 4K Read (IOPS max.) | 345.000 | 230.000 | 295.000 (estimated) | 670.000 |
Random 4K Write (IOPS max.) | 350.000 | 225.000 | 210.000 (estimated) | 650.000 |
Power Requirement | DC 3.3V | DC 3.3V | DC 3.3V | DC 3.3V |
Power Consumption (max.) | 2450 mA | 2050 mA | 1500 mA | 2450 mA |
Power Consumption (idle) | 230 mA | 150 mA | 280 mA | 670 mA |
Dimension (mm) | 80.0 x 22.0 x 3.6 | 80.0 x 22.0 x 3.6 | 80.0 x 22.0 x 3.6 | 80.0 x 22.0 x 3.6 |
MTBF | ≒2,000,000 hrs | ≒2,000,000 hrs | ≒2,000,000 hrs | ≒2,000,000 hr |
Temperature | ||||
Operating 0°C - 70°C: Standard | SP***GIMEC35*SV0 | SP***GIMEC35*EV0 | SP***GIMEC3F*SV0 | SP***GIMEC3F*SV0 |
Operating -15°C ~85°C: Extended | SP***GIMEC35*SE0 | - | - | - |
Operating -40°C ~ 85°C: Wide | SP***GIMEC35*SW0 | - | - | - |
Key Features | ||||
Power Shield | ● | ● | ● | ● |
Power Fail Protection | ||||
End-to-End Data Protection | ● | ● | ● | ● |
TRIM | ● | ● | ● | ● |
S.M.A.R.T | ● | ● | ● | ● |
DEVSLP | ● | ● | ● | ● |
Advanced Encryption Standard 256 | ● | ● | ||
SP SMART Utility | ● | ● | ● | ● |
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Model | MEA3K0E | MEA3F0E | ||
---|---|---|---|---|
Flash Technologie | 3D TLC | 3D TLC | ||
Interface | PCIe Gen3x4, NVMe | PCIe Gen3x4, NVMe | ||
Capacity | 64GB ~ 512GB | 512GB ~ 2TB | ||
Seq. Performance Read (max.) | 2,600 MB/s (estimated) | 2,470 MB/s (estimated) | ||
Seq. Performance Write (max.) | 2,000 MB/s (estimated) | 2,150 MB/s (estimated) | ||
Random 4K Read (IOPS max.) | 200,000 (estimated) | 250,000 (estimated) | ||
Random 4K Write (IOPS max.) | 200,000 (estimated) | 400,000 (estimated) | ||
Power Requirement | DC 3.3V | DC 3.3V | ||
Power Consumption (max.) | - | - | ||
Power Consumption (idle) | - | - | ||
Dimension (mm) | 42.0 x 22.0 x 3.6 | 42.0 x 22.0 x 3.6 | ||
MTBF | ≒2,000,000 hrs | ≒2,000,000 hrs | ||
Temperature | ||||
Operating 0°C - 70°C: Standard | SP***GIMEA3K*EV0 | SP***GIMEA3K*EV0 | ||
Operating -15°C ~85°C: Extended | - | - | ||
Operating -40°C ~ 85°C: Wide | - | - | ||
Key Features | ||||
Power Shield | ● | ● | ||
Power Fail Protection | ||||
End-to-End Data Protection | ● | ● | ||
TRIM | ● | ● | ||
S.M.A.R.T | ● | ● | ||
DEVSLP | ||||
Advanced Encryption Standard 256 | ||||
SP SMART Utility | ● | ● |