Industrial USB (USB 3.0)

Apro

Eigenschaften

  • Industrial USB 3.0 / 2.0 mit SLC / MLC / aSLC / 3D NAND Flash
  • Operativer Temperaturbereich von bis zu -40°C bis +85°C
  • Kapazitäten von 8GB bis 512GB
  • High Random Read/Write Performance
  • ECC Error correction code, Static- / Dynamic- / Global-Wear-Leveling, S.M.A.R.T.
  • Conformal-Coating optional

Beschreibung

Die Industrial USB Sticks von APRO sind geeignete Lösung für schreibintensive und performante Anwendungen. Der Industrial USB Stick ist geeignet für den Dauerbetriebwobei der Anwender jederzeit mittels S.M.A.R.T. Zugriff auf den aktuellen Status des USB Sticks hat.

Weitere Eigenschaften der Industrial USB Sticks

  • ECC, Bad-Block-Management, Wear-Leveling etc. zur Gewährleistung der Datenintegrität
  • Plug-And-Play an USB 1.1, USB 2.0, USB 3.0 Schnittstellen
  • Robustes Semi-Metall-Gehäuse für den Einsatz in rauen Umgebungen in denen Resistenz gegen Schock und Vibrationen gefordert wird.
  • Resistenz gegen Feuchtigkeit mittels optionalem Conformal-Coating.
  • Die komplette Serie der Industrial USB Sticks ist CE, REACH und RoHS konform.
Model HERMIT-E HERMIT-E HERMIT-E
Flash Type SLC MLC aSLC
Capacity 128MB~64GB 8GB~512GB 4GB~256GB
Compatibility USB 3.1 USB 3.1 USB 3.1
Data transfer rate FullSpeed, HighSpeed and SuperSpeed FullSpeed, HighSpeed and SuperSpeed FullSpeed, HighSpeed and SuperSpeed
Sequential read (Max.) 189.8 MB/sec 97 MB/sec 147.7 MB/sec
Sequential write (Max.) 114.9 MB/sec 60.2 MB/sec 118.3 MB/sec
Operating temp. (STD/IND or WIDE) S : 0˚C~+70˚C/ I : -40˚C~+85˚C S : 0˚C~+70˚C/ W : -40˚C~+85˚C S : 0˚C~+70˚C/ W : -40˚C~+85˚C
OS supported Windows series O.S.Linux, VxWorks and DOS Windows series O.S.Linux, VxWorks and DOS Windows series O.S.Linux, VxWorks and DOS
Power requirement 5V ± 10% via USB port 5V ± 10% via USB port 5V ± 10% via USB port
Wear-leveling Static, Dynamic and Global Static, Dynamic and Global Static, Dynamic and Global
TBW Up to 452.8 TBW at 64GB Up to 125 TBW at 512GB Up to 503 TBW at 256GB
Erase counts 60,000 3,000 20,000
Dimension (WxLxH,mm) 17.60 x 62.10 x 8.40 17.60 x 62.10 x 8.40 17.60 x 62.10 x 8.40

Silicon Power

  • Compliant with USB standard specification 3.0, backward compatible with USB 2.0 and USB 1.1
  • Support USB mass Storage Command Protocol
  • Operating as Boot Disk, or Code Storage Device for Embeded Operating System
Model UFD790 UFD350 UFD320 UFD-I50
Flash Technologie SLC 3D TLC 3D TLC MLC
Interface USB 3.0 USB 3.0 USB 3.0 USB 3.0
Capacity 1GB ~ 16GB 32GB ~ 512GB 32GB ~256GB 8GB ~ 64GB
Seq. Performance Read (max.) 90 MB/s 200 MB/s 90 MB/s 195 MB/s
Seq. Performance Write (max.) 45 MB/s 140 MB/s 70 MB/s 85 MB/s
Power Requirement DC 5.0V DC 5.0V DC 5.0V DC 5.0V
Power Consumption (max.) 200 mA 330 mA 240 mA 330 mA
Power Consumption (idle) 75 mA 65 mA 80 mA 65 mA
Dimension (mm) 60.6 x 18.0 x 8.1 60.6 x 18.0 x 8.1 60.6 x 18.0 x 8.1 60.6 x 18.0 x 8.1
MTBF ≒2,000,000 hrs ≒2,000,000 hrs ≒2,000,000 hrs ≒2,000,000 hrs
Temperature
Operating 0°C ~ 70°C: Standard SP****IUFD791NV0 SP***GIUFD351NV0 SP***GIUFD32*NV0 SP***GBUF3DNPV*2*U
Key Features
Duration (cycles) 10000 10000 10000 10000
SP SMART Utility